Bosch will Build New Plan
2008-11-17 Source：english.chinabuses.com
The expansion of the Bosch semiconductor manufacturing facility is progressing as planned. The new plant would have a daily capacity of up to 1,000 silicon wafers. The start of production is scheduled for mid-2009. The function of the wafers and components will be tested at the new test center, which is currently also under construction. The semiconductor and micro-mechanical chips are primarily used in the automotive industry. As components in control units, they are the "central nervous system" for a large number of functions in vehicles. These include electronic safety systems such as ABS, ESP or airbags, economical and clean engines with electronic engine management, or modern driver assistance systems.
Bosch Group comprises Robert Bosch GmbH and its more than 300 subsidiaries and regional companies in roughly 50 countries. This worldwide development, manufacturing, and sales network are the foundation for further growth. In 2007, Bosch spent roughly 3.6 billion euros for research and development, and applied for just under 3,300 patents worldwide.
Views:0Editor：Frederick
Related China Bus News
